May 13, 2011 Indium Corporation introduced SAC105+Mn, the industry's first RELIABLE, Pb-free, low-Ag alloy, at a press conference at NEPCON China (Shanghai). Indium Corporation's Director of Marketing Communications Rick Short and Vice President of Technology Dr. Ning-Cheng Lee presented data, information, results, and copies of the white paper, Achieving High Reliability Low Cost Lead-free SAC Solder Joints via Mn or Ce Doping, to attendees. Representatives from SuperFlex, the new alloy's first licensee, were also on hand to discuss the product. "SAC105+Mn has thermal cycling comparable to, and drop testing significantly better than, SAC305," Rick said. "And its thermal reliability characteristics are comparable to, and in some cases better than, standard high-cost, high-silver solder alloys." Additional attributes include: a drop shock reliability better than SAC105 for the hand held device market, a reduced environmental impact because it is lead-free, a manufacturing yield comparable to SAC305, and reduced silver content for decreased price volatility. SAC105+Mn is available in high volume to Chinese licensees. For more information about SAC105+Mn or to view the entire press conference, visit indium.com/SAC105Mn.

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